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About this Engineering article

Effect of Vacuum Break After the Barrier Layer Deposition on the Electromigration Performance of Aluminum Based Line Interconnects by Cher Ming Tan; Arijit Roy; Kok Tong Tan; Derek Sim Kwang Ye; Frankie Low is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Cher Ming Tan; Arijit Roy; Kok Tong Tan; Derek Sim Kwang Ye; Frankie Low
Publisher
Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
Published
2005
Language
EN
Field
Engineering (Physical Sciences)

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