Opening book details…
Can I read Over- and underpotential deposition of copper from a deep eutectic solvent: Pt(1 1 1) single crystal versus polycrystalline Pt substrates on EtoBox?
Over- and underpotential deposition of copper from a deep eutectic solvent: Pt(1 1 1) single crystal versus polycrystalline Pt substrates by Oleg I. Zaytsev; Maria R. Ehrenburg; Elena B. Molodkina; Peter Broekmann; Alexander V. Rudnev is a Engineering article available to read on EtoBox.
What is Over- and underpotential deposition of copper from a deep eutectic solvent: Pt(1 1 1) single crystal versus polycrystalline Pt substrates about?
Deep eutectic solvents (DESs) attract ever greater interest as nonaqueous media for the electrodeposition of metals and alloys. This work investigates the initial stages of Cu electrodeposition from DES representing a mixture of choline chloride and ethylene glycol (ChCl:EG) with a (1:2) molar ratio that contains CuCl or CuCl2 salts. These studies were performed by means of cyclic voltammetry and scanning probe microscopy on single-crystalline Pt(111) and polycrystalline Pt(poly) electrodes. Additional experiments on Cu deposition were carried out using an aqueous Cl−-rich solution (3 M NaCl + 0.01 M CuCl). The process of Cu underpotential deposition (UPD) on the surface of Pt(111) in DES is observed for the first time. It is proposed that a complete (1 × 1) monolayer of Cu adatoms is formed at potentials more positive than the onset of overpotential deposition (OPD). The comparison of results for Pt(111) and Pt(poly) in ChCl:EG (1:2) and in the aqueous 3 M NaCl solution confirms that the surface morphology and (co)adsorption of solution components play an important role in the Cu UPD process. In DES, as well as in the aqueous solutions containing CuCl, Cu OPD occurs via the reduct
Who reads Over- and underpotential deposition of copper from a deep eutectic solvent: Pt(1 1 1) single crystal versus polycrystalline Pt substrates?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Oleg I. Zaytsev; Maria R. Ehrenburg; Elena B. Molodkina; Peter Broekmann; Alexander V. Rudnev
- Publisher
- Elsevier BV
- Published
- 2022
- Language
- EN
- Field
- Engineering (Physical Sciences)