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About this Engineering article
Low Temperature Direct Bonding of InP and Si3N4-Coated Silicon Wafers for Photonic Device Integration by Wang, Yadong; Ng, Doris Keh-Ting; Wang, Qian; Pu, Jing; Liu, Chongyang; Ho, Seng-Tiong is a Engineering article available to read on EtoBox.
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- Author
- Wang, Yadong; Ng, Doris Keh-Ting; Wang, Qian; Pu, Jing; Liu, Chongyang; Ho, Seng-Tiong
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
- Published
- 2012
- Field
- Engineering (Physical Sciences)