About this scholarly article

2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Innovative use of FA techniques SCM and OBIRCH along with TCAD to resolve junction scaling issues at advanced technology nodes by Johnson, Gregory; Nxumalo, Jochonia; Arya, Ankur; Johnson, Jeffrey; Gao, Qun; Greene, Brian is a scholarly article available to read on EtoBox.

Author

Johnson, Gregory; Nxumalo, Jochonia; Arya, Ankur; Johnson, Jeffrey; Gao, Qun; Greene, Brian

Publisher

IEEE

Published

2018

Language

EN