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About this Engineering article
Active Thermomechanical Stress Cancellation of Solder Joints in Surface-Mount Technology Integrated Circuits by Cibils, Roberto M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Cibils, Roberto M.
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2019
- Language
- EN
- Field
- Engineering (Physical Sciences)