About this scholarly article

2018 20th International Conference on Electronic Materials and Packaging (EMAP) - HFSS simulation of wireless inter-chip communication for 5G applications by Long, Yu-Hao; YuYu, Jhih; Pan, Chung-Long; Huang, Yu-Jung is a scholarly article available to read on EtoBox.

Author

Long, Yu-Hao; YuYu, Jhih; Pan, Chung-Long; Huang, Yu-Jung

Publisher

IEEE

Published

2018