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About this scholarly article
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) - A new deep reactive ion etching process by dual sidewall protection layer by Ohara, J.; Kano, K.; Takeuchi, Y.; Ohya, N.; Otsuka, Y.; Akita, S. is a scholarly article available to read on EtoBox.
- Author
- Ohara, J.; Kano, K.; Takeuchi, Y.; Ohya, N.; Otsuka, Y.; Akita, S.
- Publisher
- IEEE
- Published
- 2000
- Language
- EN
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