Can I read Wafer Bonding Volume 75 on EtoBox?

Wafer Bonding Volume 75 by Alexe, Marin; Gösele, Ulrich is a scholarly article available to read on EtoBox.

What is Wafer Bonding Volume 75 about?

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Author

Alexe, Marin; Gösele, Ulrich

Publisher

Springer Berlin Heidelberg : Imprint: Springer

Published

2004

Language

EN

ISBN

9783662108277