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About this Materials Science article
Modeling a Copper/carbon Nanotube Composite for Applications in Electronic Packaging by Feng, Ying; Burkett, Susan L. is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Feng, Ying; Burkett, Susan L.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0927-0256)
- Published
- 2015
- Language
- EN
- Field
- Materials Science (Physical Sciences)