About this Materials Science article
The Reliability of Copper Pillar Under the Coupling of Thermal Cycling and Electric Current Stressing by Ma, Hui-Cai; Guo, Jing-Dong; Chen, Jian-Qiang; Wu, Di; Liu, Zhi-Quan; Zhu, Qing-Sheng; Zhang, Li; Guo, Hong-Yan is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Ma, Hui-Cai; Guo, Jing-Dong; Chen, Jian-Qiang; Wu, Di; Liu, Zhi-Quan; Zhu, Qing-Sheng; Zhang, Li; Guo, Hong-Yan
- Publisher
- Springer US; Springer-Verlag; Kluwer Academic Publishers; Springer Science and Business Media LLC; Society for Mining, Metallurgy and Exploration Inc. (ISSN 0957-4522)
- Published
- 2016
- Language
- EN
- ISBN
- 9781085401654
- Field
- Materials Science (Physical Sciences)