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About this Engineering article
Transient thermal analysis of an ACF package assembly process by Chiriac, V.A.; Lee, T.Y.T. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Chiriac, V.A.; Lee, T.Y.T.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1521-3331)
- Published
- 2001
- Field
- Engineering (Physical Sciences)