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Nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au / Ni / Cu ball grid array packages were investigated. After the addition of nano Ni powder in Sn-based solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine zn-Ni compound was found.

Author
eid elsayed
Language
EN