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About this Engineering article
Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging by Park, M.S.; Gibbons, S.L.; Arróyave, R. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Park, M.S.; Gibbons, S.L.; Arróyave, R.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 2014
- Language
- EN
- Field
- Engineering (Physical Sciences)