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About this Physics and Astronomy article
Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology by J. W. Jang; P. G. Kim; K. N. Tu; D. R. Frear; P. Thompson is a Physics and Astronomy article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Physics and Astronomy.
- Author
- J. W. Jang; P. G. Kim; K. N. Tu; D. R. Frear; P. Thompson
- Publisher
- American Institute of Physics; AIP Publishing; Publons (ISSN 0021-8979)
- Published
- 1999
- Field
- Physics and Astronomy (Physical Sciences)