About this scholarly article

2006 1st Electronic Systemintegration Technology Conference - Rheological Characterisation of New Lead-Free Solder Paste Formulations for Flip-Chip Assembly by Durairaj, R.; Mallik, S.; Marks, A.; Winter, M.; Bauer, R.; Ekere, N.N. is a scholarly article available to read on EtoBox.

Author

Durairaj, R.; Mallik, S.; Marks, A.; Winter, M.; Bauer, R.; Ekere, N.N.

Publisher

IEEE

Published

2006

Language

EN