About this Engineering article
Tool Wear Characteristics and Their Effects on Nanoscale Ductile Mode Cutting of Silicon Wafer by X.P. Li; T. He; M. Rahman is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- X.P. Li; T. He; M. Rahman
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0043-1648)
- Published
- 2005
- Language
- EN
- Field
- Engineering (Physical Sciences)