About this scholarly article

56th Electronic Components and Technology Conference 2006 - Combined Thermal and Electromigration Exposure Effect on SnAgCu BGA Solder Joint Reliability by Luhua Xu, ; Pang, J.H.L. is a scholarly article available to read on EtoBox.

Author

Luhua Xu, ; Pang, J.H.L.

Publisher

IEEE

Published

2006

Language

EN