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About this Engineering article
Superplastic Creep of Low Melting Point Solder Joints by Z. Mei; J. W. Morris is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Z. Mei; J. W. Morris
- Publisher
- Springer US; Springer-Verlag; Springer New York LLC; Springer Science and Business Media LLC (ISSN 0361-5235)
- Published
- 1992
- Field
- Engineering (Physical Sciences)