About this scholarly article

International Electron Devices Meeting. IEDM Technical Digest - Modeling of pattern-dependent on-chip interconnect geometry variation for deep-submicron process and design technology by Nakagawa, O.S.; Oh, S.-Y.; Ray, G. is a scholarly article available to read on EtoBox.

Author

Nakagawa, O.S.; Oh, S.-Y.; Ray, G.

Publisher

IEEE

Published

1997