About this scholarly article

2013 International SoC Design Conference (ISOCC) - Efficient TSV repair method for 3D memories by Kim, Ilwoong; Cho, Keewon; Kang, Sungho is a scholarly article available to read on EtoBox.

Author

Kim, Ilwoong; Cho, Keewon; Kang, Sungho

Publisher

IEEE

Published

2013

Language

EN