About this scholarly article

3rd Electronics System Integration Technology Conference ESTC - Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking by Labie, R; Limaye, P; Lee, KW; Berry, CJ; Beyne, E; De Wolf, I is a scholarly article available to read on EtoBox.

Author

Labie, R; Limaye, P; Lee, KW; Berry, CJ; Beyne, E; De Wolf, I

Publisher

IEEE

Published

2010

Language

EN