About this scholarly article

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Viscoplastic behavior of diamond die attach subjected to high temperature conditions by Msolli, S.; Baazaoui, A.; Dalverny, O.; Alexis, J.; Karama, M. is a scholarly article available to read on EtoBox.

Author

Msolli, S.; Baazaoui, A.; Dalverny, O.; Alexis, J.; Karama, M.

Publisher

IEEE

Published

2012

Language

EN