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About this scholarly article
SPIE Proceedings [SPIE Advanced Lithography - San Jose, CA (Sunday 25 February 2007)] Emerging Lithographic Technologies XI - Demolding strategy to improve the hot embossing throughput by Leveder, Tanguy; Lercel, Michael J.; Landis, Stefan; Davoust, Laurent; Soulan, Sebastien; Chaix, Nicolas is a scholarly article available to read on EtoBox.
- Author
- Leveder, Tanguy; Lercel, Michael J.; Landis, Stefan; Davoust, Laurent; Soulan, Sebastien; Chaix, Nicolas
- Publisher
- SPIE
- Published
- 2007
- Language
- EN