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About this Engineering article
Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density by Sang-Su Ha; Jong-Woong Kim; Jeong-Won Yoon; Sang-Ok Ha; Seung-Boo Jung is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Sang-Su Ha; Jong-Woong Kim; Jeong-Won Yoon; Sang-Ok Ha; Seung-Boo Jung
- Publisher
- Springer US; Springer-Verlag; Springer New York LLC; Springer Science and Business Media LLC (ISSN 0361-5235)
- Published
- 2008
- Field
- Engineering (Physical Sciences)
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