About this Engineering article
A 3D numerical study of a molten solder droplet's wetting and solidifying on a pillar with application to electronic packaging by Xiong, Wei; Cheng, Ping is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Xiong, Wei; Cheng, Ping
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0017-9310)
- Published
- 2020
- Language
- EN
- Field
- Engineering (Physical Sciences)