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Texture development, microstructure and phase transformation characteristics of sputtered Ni–Ti Shape Memory Alloy films grown on TiN by R.M.S. Martins; N. Schell; H. Reuther; L. Pereira; K.K. Mahesh; R.J.C. Silva; F.M. Braz Fernandes is a Engineering article available to read on EtoBox.

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Near equiatomic Ni-Ti films have been deposited by magnetron co-sputtering on TiN films with a topmost layer formed by b 111N oriented grains (TiN/SiO 2 /Si(100) substrate) in a chamber installed at a synchrotron radiation beamline. In-situ X-ray diffraction during Ni-Ti film growth and their complementary ex-situ characterization by Auger electron spectroscopy, scanning electron microscopy and electrical resistivity measurements during temperature cycling have allowed us to establish a relationship between the structure and processing parameters. A preferential development of b 110N oriented grains of the B2 phase since the beginning of the deposition has been observed (without and with the application of a substrate bias voltage of -45 and -90 V). The biaxial stress state is considerably influenced by the energy of the bombarding ions, which is dependent on the substrate bias voltage value applied during the growth of the Ni-Ti film. Furthermore, the present work reveals that the control of the energy of the bombarding ions is a promising tool to vary the transformation characteristics of Ni-Ti films, as shown by electrical resistivity measurements during temperature cycling. The

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Author

R.M.S. Martins; N. Schell; H. Reuther; L. Pereira; K.K. Mahesh; R.J.C. Silva; F.M. Braz Fernandes

Publisher

Elsevier Science; Elsevier ; Elsevier Sequoia; Elsevier BV (ISSN 0040-6090)

Published

2010

Language

EN

Field

Engineering (Physical Sciences)