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About this Engineering article
Influence of the chip temperature on the moisture-induced failure rate of plastic-encapsulated devices : Dieter Stroehle. IEEE Trans. Components Hybrids Mfg Technol.CHMT-6 (4), 537 (December 1983) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1984
- Language
- EN
- Field
- Engineering (Physical Sciences)