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About this Engineering article
Low-loss through silicon Vias (TSVs) and transmission lines for 3D optoelectronic integration by Wang, Shuxiao (author);Wang, Qing (author);Liu, Yufei (author);Jia, Lianxi (author);Yu, Mingbin (author);Sun, Peng (author);Geng, Fei (author);Cai, Yan (author);Tu, Zhijuan (author) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Wang, Shuxiao (author);Wang, Qing (author);Liu, Yufei (author);Jia, Lianxi (author);Yu, Mingbin (author);Sun, Peng (author);Geng, Fei (author);Cai, Yan (author);Tu, Zhijuan (author)
- Publisher
- Elsevier BV
- Published
- 2021
- Field
- Engineering (Physical Sciences)