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REFERENCES 1. R C Chu. The Perpetual Challenges of Electronic Cooling Technology for Computer Product Applications-from laptop to supercomputers. 2. V A Chiriac and TYT Lee. Transient thermal analysis of an ACF package assembly process. 3. K Jambunathan, E Lai, M A Moss and B L Button. A review of heat transfer data for single circular jet impingement. 4. D A Zumbrunnen and M Aziz. Convective heat transfer enhancement

Author

Shah Kalpit

Language

EN