Skip to content

Opening book details…

About this Engineering article

Evaluation of Alternative Materials for System-on-Package (SOP) Substrates by Shinotani, K.-I.; Raj, P.M.; Seo, M.; Bansal, S.; Sakurai, H.; Bhattacharya, S.K.; Tummala, R. is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Shinotani, K.-I.; Raj, P.M.; Seo, M.; Bansal, S.; Sakurai, H.; Bhattacharya, S.K.; Tummala, R.
Publisher
IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1521-3331)
Published
2004
Field
Engineering (Physical Sciences)

More by Shinotani, K.-I.; Raj, P.M.; Seo, M.; Bansal, S.; Sakurai, H.; Bhattacharya, S.K.; Tummala, R.

Browse all works by Shinotani, K.-I.; Raj, P.M.; Seo, M.; Bansal, S.; Sakurai, H.; Bhattacharya, S.K.; Tummala, R.