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About this Engineering article
Tribological behavior of 6H–SiC wafers in different chemical mechanical polishing slurries by Zhang, Qixiang (author);Pan, Jisheng (author);Zhang, Xiaowei (author);Lu, Jiabin (author);Yan, Qiusheng (author) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Zhang, Qixiang (author);Pan, Jisheng (author);Zhang, Xiaowei (author);Lu, Jiabin (author);Yan, Qiusheng (author)
- Publisher
- Elsevier BV
- Published
- 2021
- Language
- EN
- Field
- Engineering (Physical Sciences)