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About this Engineering article
Vacuum diffusion bonding of high-entropy Al0.85CoCrFeNi alloy to TiAl intermetallic by Lei, Y.; Hu, S.P.; Yang, T.L.; Song, X.G.; Luo, Y.; Wang, G.D. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lei, Y.; Hu, S.P.; Yang, T.L.; Song, X.G.; Luo, Y.; Wang, G.D.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0924-0136)
- Published
- 2020
- Language
- EN
- Field
- Engineering (Physical Sciences)