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Role of interaction forces in controlling the stability and polishing performance of CMP slurries by G.Bahar Basim; Ivan U Vakarelski; Brij M Moudgil is a Chemistry article available to read on EtoBox.

What is Role of interaction forces in controlling the stability and polishing performance of CMP slurries about?

Chemical mechanical polishing (CMP) is an essential step in metal and dielectric planarization in multilayer microelectronic device fabrication. In the CMP process it is necessary to minimize the extent of surface defect formation while maintaining good planarity and optimal material removal rates. These requirements are met through the control of chemical and mechanical interactions during the polishing process by engineering the slurry chemistry, particulate properties, and stability. In this study, the performance of surfactant-stabilized silica CMP slurries at high pH and high ionic strengths are investigated with particular emphasis on the particle-particle and particle-substrate interactions. It is shown that for the design of consistently high performing slurries, stability of abrasive particles must be achieved under the dynamic processing conditions of CMP while maintaining sufficient pad-particle-wafer interactions.

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Author

G.Bahar Basim; Ivan U Vakarelski; Brij M Moudgil

Publisher

Elsevier Science; Elsevier ; Elsevier Inc.; Elsevier BV (ISSN 0021-9797)

Published

2003

Language

EN

Field

Chemistry (Physical Sciences)