About this document
Wafer Fabrication Process Overview by Aswath Balaji is a document available to read on EtoBox.
The document discusses the process for micro machining wafer preparation. It involves 8 key steps: 1) crystal pulling to form silicon ingots, 2) rod grinding to specified diameters, 3) wire cutting to slice ingots into wafers, 4) edge profiling to round wafer edges, 5) lapping to remove saw damage, 6) polishing to create flat mirror surfaces, 7) laser inspection to detect particles, and 8) epitaxy to grow thin crystalline layers on wafers. The preparation process is crucial for ensuring high quality wafers
- Author
- Aswath Balaji
- Language
- EN