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About this Engineering article
Oscillation-Based Prebond TSV Test by Huang, Li-Ren; Huang, Shi-Yu; Sunter, Stephen; Tsai, Kun-Han; Cheng, Wu-Tung is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Huang, Li-Ren; Huang, Shi-Yu; Sunter, Stephen; Tsai, Kun-Han; Cheng, Wu-Tung
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0278-0070)
- Published
- 2013
- Language
- EN
- Field
- Engineering (Physical Sciences)
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