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FET mobility degradation and device mismatch due to packaging induced die stress by Jaeger, R (author);Bradley, A (author);Suhling, J (author);Zou, Y (author) is a scholarly article available to read on EtoBox.
- Author
- Jaeger, R (author);Bradley, A (author);Suhling, J (author);Zou, Y (author)
- Published
- 1997
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