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SPIE Proceedings [SPIE SPIE MOEMS-MEMS - San Francisco, California, USA (Saturday 2 February 2013)] Advanced Fabrication Technologies for Micro/Nano Optics and Photonics VI - Photonic wire bonding: connecting nanophotonic circuits across chip boundaries by Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Balthasar, G.; Hoffmann, J.; Hoose, T.; Huebner, P.; Hillerkuss, D.; Schmogrow, R.; von Freymann, Georg; Schoenfeld, Winston V.; Rumpf, Raymond C. is a scholarly article available to read on EtoBox.

Author
Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Balthasar, G.; Hoffmann, J.; Hoose, T.; Huebner, P.; Hillerkuss, D.; Schmogrow, R.; von Freymann, Georg; Schoenfeld, Winston V.; Rumpf, Raymond C.
Publisher
SPIE
Published
2013

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