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About this Engineering article
Effect of Interfacial Microstructures on the Bonding Strength of Sn–3.0Ag–0.5Cu Pb-Free Solder Bump by J. Kim; M. Jeong; S. Yoo; Y. Park is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- J. Kim; M. Jeong; S. Yoo; Y. Park
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 2012
- Field
- Engineering (Physical Sciences)