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The Engineering of Microelectronic Thin and Thick Films by C. E. Jowett (auth.) is a nonfiction available to read on EtoBox.
What is The Engineering of Microelectronic Thin and Thick Films about?
It is often difficult for design and production engineers to decide between thick-and thin-film technologies in the design and fabrication of hybrid integrated circuits. In the case of thick film, the deposited pattern of conductors, resistors, capacitors and inductors is applied to the substrate by screen-printing and firing special conductive, resistive or dielectric pastes. Thin-film layers, on the other hand, are deposited in vacuum by evaporation, screen and fire techniques, cathode or ion impact sputtering, chemical or electroless metal deposition, vapour plating and direct writing. In order to obtain maximum advantages it is necessary for the design and project engineer to be aware of these various technologies. Thin-film microelectronics is a technology involving configurations possessing high surface-to-surface volume ratios, such as the implementation of large-scale hybrid integrated circuits, using hybrid monolithic LSI chips; this poses the problem of a technological approach, suitable to obtain interconnection networks characterised by high densities with low resistivity conductive lines in multilayer structures, and with low parasitic capacitance at the crossovers. Al
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Common subject areas: history, science, philosophy, social sciences.
- Author
- C. E. Jowett (auth.)
- Publisher
- Macmillan Education UK
- Published
- 1976
- Language
- EN
- ISBN
- 9781349026869
- Category
- nonfiction
- Subjects
- Science, Physics, Stem
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