About this scholarly article

2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Fabrication of high Q factor integrated passive devices based on embedded Fan-out wafer level package by Zhou, Xiufeng; Ming, Xuefei; Ji, Yong; Gao, Nayan; Li, Yang; Yao, Xin; Xue, Kai is a scholarly article available to read on EtoBox.

Author

Zhou, Xiufeng; Ming, Xuefei; Ji, Yong; Gao, Nayan; Li, Yang; Yao, Xin; Xue, Kai

Publisher

IEEE

Published

2017

Language

EN