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About this Engineering article
Fast Isothermal Solidification During Transient Liquid Phase Bonding of a Nickel Alloy Using Pure Copper Filler Metal: Solubility vs Diffusivity by Ghasemi, Ali; Pouranvari, Majid is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ghasemi, Ali; Pouranvari, Majid
- Publisher
- The Minerals, Metals & Materials Society; Springer-Verlag; Springer Boston; Springer Science and Business Media LLC (ISSN 1073-5623)
- Published
- 2019
- Field
- Engineering (Physical Sciences)