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About this Engineering article
Electromigration Characteristics of Copper Interconnects by Tao, J.; Cheung, N.W.; Hu, C. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Tao, J.; Cheung, N.W.; Hu, C.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0741-3106)
- Published
- 1993
- Field
- Engineering (Physical Sciences)