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About this Engineering article
Effects of Mold Geometries and Initial Resist Thickness on Filling Behavior in UV-Nanoimprint Lithography by Du, Jun; Wei, Zhengying; He, Wei; Tang, Yiping is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Du, Jun; Wei, Zhengying; He, Wei; Tang, Yiping
- Publisher
- American Scientific Publishers (ISSN 1546-1955)
- Published
- 2012
- Language
- EN
- Field
- Engineering (Physical Sciences)
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