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About this Engineering article

Effects of Mold Geometries and Initial Resist Thickness on Filling Behavior in UV-Nanoimprint Lithography by Du, Jun; Wei, Zhengying; He, Wei; Tang, Yiping is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Du, Jun; Wei, Zhengying; He, Wei; Tang, Yiping
Publisher
American Scientific Publishers (ISSN 1546-1955)
Published
2012
Language
EN
Field
Engineering (Physical Sciences)

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