About this scholarly article

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling by Chen, Chienchih; Suhling, Jeffrey C.; Lall, Pradeep is a scholarly article available to read on EtoBox.

Author

Chen, Chienchih; Suhling, Jeffrey C.; Lall, Pradeep

Publisher

American Society of Mechanical Engineers

Published

2018

Language

EN