Opening book details…
About this Engineering article
A 33% Improvement in Efficiency of Wireless Inter-Chip Power Delivery by Thin Film Magnetic Material for Three-Dimensional System Integration by Niitsu, Kiichi; Yuxiang, Yuan; Ishikuro, Hiroki; Kuroda, Tadahiro is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Niitsu, Kiichi; Yuxiang, Yuan; Ishikuro, Hiroki; Kuroda, Tadahiro
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 2009
- Language
- EN
- Field
- Engineering (Physical Sciences)
More by Niitsu, Kiichi; Yuxiang, Yuan; Ishikuro, Hiroki; Kuroda, Tadahiro
Browse all works by Niitsu, Kiichi; Yuxiang, Yuan; Ishikuro, Hiroki; Kuroda, Tadahiro