Opening book details…
About this Engineering article
MOCVD of Tungsten Nitride Films Using W(CO)[sub 6] and NH[sub 3] for Cu Diffusion Barrier by Lee, Brad H.; Yong, Kijung is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lee, Brad H.; Yong, Kijung
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
- Published
- 2004
- Language
- EN
- Field
- Engineering (Physical Sciences)