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About this Engineering article
Characterization and Modeling of Oxide Chemical-mechanical Polishing Using Planarization Length and Pattern Density Concepts by D. Ouma; D. Boning; J. Chung; W. Easter; V. Saxena; S. Misra; A. Crevasse is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- D. Ouma; D. Boning; J. Chung; W. Easter; V. Saxena; S. Misra; A. Crevasse
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0894-6507)
- Published
- 2002
- Language
- EN
- Field
- Engineering (Physical Sciences)
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