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About this Engineering article
Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - a micromechanics model by Liu, P.; Cheng, L.; Zhang, Y.-W. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Liu, P.; Cheng, L.; Zhang, Y.-W.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1521-3323)
- Published
- 2003
- Field
- Engineering (Physical Sciences)