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About this Engineering article

Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging by Ja-Myeong Koo; Seung-Boo Jung is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Ja-Myeong Koo; Seung-Boo Jung
Publisher
Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
Published
2007
Language
EN
Field
Engineering (Physical Sciences)

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