About this scholarly article

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Flip chip molding - highly reliable flip chip encapsulation by Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H. is a scholarly article available to read on EtoBox.

Author

Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.

Publisher

IEEE

Published

2002

Language

EN